FPSC: Future Proof Solder Core

FPSC is a standardized footprint and pinout for embedded devices. This technology reduces design complexity without limiting development because PHYTEC provides a high level of pin compatibility with options to customize, giving the power of design back to the engineer.

Signal categories are carefully designed for maximum flexibility and scalability between phyFLEX SOMs

• Mandatory Signals: the foundational features every module needs for baseline functionality and maximum interoperability providing 100% compatibility up and down the phyFLEX product line.

• Optional Signals: common interfaces used in many applications today that will likely remain relevant in future chip generations, providing standardization to pin position. 

• Specialized Signals: interfaces reserved for advanced or unique features of certain processor families with no guaranteed standardization. 

This structure enables the use of current and future processor features without compromising standardization. FPSC enables scalable performance and cost-effective carrier board design through staggered pins and optimized pinout routing.

FTGA Soldering Technology combined with PHYTEC's Solder Anchor Joints provide stability and robustness, tested for shock and vibration resistance (Industrial, Military, Automotive) EN 60068-2 

Reduced Layout Complexity for Carrier Board Development

• Up to 70% PCB Cost Savings 

• 6-layer PCB, Drilled via technology, 100µm line and space

• Optimization of Pad sizes and pitch, GND pin location

• Improved signal integrity, differential signals defined at the edge of a signal ring

Future proof and minimize risk with PHYTEC's FPSC interchangeable phyFLEX SOMs